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TLE2071IP 数据表(PDF) 4 Page - Texas Instruments

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部件名 TLE2071IP
功能描述  EXCALIBUR LOW-NOISE HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS
PDF  77 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

TLE2071IP 数据表(HTML) 4 Page - Texas Instruments

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TLE207x, TLE207xA, TLE207xY
EXCALIBUR LOW-NOISE HIGH-SPEED
JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS181A – FEBRUARY 1997 – REVISED MARCH 2000
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLE2071Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2071C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
× 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF THE CHIP.
+
–
OUT
IN +
IN –
VCC +
(6)
(3)
(2)
(5)
(1)
(7)
(4)
OFFSET N1
OFFSET N2
VCC –
58
85
(1)
(2)
(4)
(5)
(6)
(7)
(8)
(3)



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