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TLV2211CDBV 数据表(PDF) 27 Page - Texas Instruments |
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TLV2211CDBV 数据表(HTML) 27 Page - Texas Instruments |
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27 / 29 page ![]() TLV2211, TLV2211Y Advanced LinCMOS ™ RAIL-TO-RAIL MICROPOWER SINGLE OPERATIONAL AMPLIFIERS SLOS156B – MAY 1996 – REVISED JANUARY 1997 27 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION macromodel information Macromodel information provided was derived using Microsim Parts ™, the model generation software used with Microsim PSpice ™. The Boyle macromodel (see Note 6) and subcircuit in Figure 53 are generated using the TLV2211 typical electrical and operating characteristics at TA = 25°C. Using this information, output simulations of the following key parameters can be generated to a tolerance of 20% (in most cases): D Maximum positive output voltage swing D Maximum negative output voltage swing D Slew rate D Quiescent power dissipation D Input bias current D Open-loop voltage amplification D Unity-gain frequency D Common-mode rejection ratio D Phase margin D DC output resistance D AC output resistance D Short-circuit output current limit NOTE 6: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers”, IEEE Journal of Solid-State Circuits, SC-9, 353 (1974). OUT + – + – + – + – + – + – + – + – + – .SUBCKT TLV2211 1 2 3 4 5 C1 11 12 8.86E–12 C2 6 7 50.00E–12 DC 5 53 DX DE 54 5 DX DLP 90 91 DX DLN 92 90 DX DP 43DX EGND 99 0 POLY (2) (3,0) (4,0) 0 .5 .5 FB 7 99 POLY (5) VB VC VE VLP + VLN 0 4.29E6 –6E6 6E6 6E6 –6E6 GA 6 0 11 12 9.425E–6 GCM 0 6 10 99 1320.2E–12 ISS 3 10 DC 1.250E–6 HLIM 90 0 VLIM 1K J1 11 2 10 JX J2 12 1 10 JX R2 6 9 100.0E3 RD1 60 11 106.1E3 RD2 60 12 106.1E3 R01 8 5 50 R02 7 99 150 RP 3 4 419.2E3 RSS 10 99 160.0E6 VAD 60 4 –.5 VB 9 0 DC 0 VC 3 53 DC .55 VE 54 4 DC .55 VLIM 7 8 DC 0 VLP 91 0 DC 0.1 VLN 0 92 DC 2.6 .MODEL DX D (IS=800.0E–18) .MODEL JX PJF (IS=500.0E–15 BETA=166E–6 + VTO=–.004) .ENDS VDD + RP IN – 2 IN + 1 VDD – VAD RD1 11 J1 J2 10 RSS ISS 3 12 RD2 60 VE 54 DE DP VC DC 4 C1 53 R2 6 9 EGND VB FB C2 GCM GA VLIM 8 5 RO1 RO2 HLIM 90 DLP 91 DLN 92 VLN VLP 99 7 Figure 53. Boyle Macromodel and Subcircuit PSpice and Parts are trademark of MicroSim Corporation. |
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