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PCF8576CU/2 数据表(PDF) 43 Page - NXP Semiconductors |
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PCF8576CU/2 数据表(HTML) 43 Page - NXP Semiconductors |
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43 / 56 page ![]() PCF8576C_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 9 July 2009 43 of 56 NXP Semiconductors PCF8576C Universal LCD driver for low multiplex rates Fig 36. Bare die outline of PCF8576CU References Outline version European projection Issue date IEC JEDEC JEITA PCF8576CU pcf8576cu_do 29-06-02 Unit mm max nom min 0.38 2.82 0.610 0.096 0.110 0.097 0.110 A Dimensions Note 1. Pad size 2. Passivation opening 3. Dimension not drawn to scale 4. Marking code: PC8576C-1 Wire bond die; 56 bonding pads; 3.0 x 2.82 x 0.38 mm PCF8576CU DE 3.00 e(3) P1(1) P2(2) P3(1) P4(2) 0.097 0 0.5 1 mm scale detail X P4 P2 P1 P3 A e X 0 0 y x D E (4) F C2 C1 35 50 51 56 1 7 8 20 21 34 |
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