LTM9002

27

9002f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994

2. ALL DIMENSIONS ARE IN MILLIMETERS

LAND DESIGNATION PER JESD MO-222, SPP-010

5. PRIMARY DATUM -Z- IS SEATING PLANE

6. THE TOTAL NUMBER OF PADS: 108

4

3

DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,

BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.

THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR

MARKED FEATURE

SYMBOL

aaa

bbb

eee

TOLERANCE

0.15

0.10

0.05

2.22 – 2.42

DETAIL B

DETAIL B

SUBSTRATE

MOLD

CAP

0.27 – 0.37

1.95 – 2.05

11.25

BSC

PACKAGE TOP VIEW

15

BSC

4

PAD 1

CORNER

X

Y

aaa Z

aaa Z

DETAIL A

10.16

BSC

1.27

BSC

13.97

BSC

11

10

9

8

7

6

5

4

3

2

PACKAGE BOTTOM VIEW

DIA (0.635)

PAD 1

3

PADS

SEE NOTES

12

1

A

B

C

D

E

F

G

H

J

SUGGESTED PCB LAYOUT

TOP VIEW

1.270

1.270

0.000

2.540

2.540

3.810

3.810

5.080

5.080

LGA 108 0707 REV Ø

PACKAGE IN TRAY LOADING ORIENTATION

LTMXXXXXX

μModule

TRAY PIN 1

BEVEL

COMPONENT

PIN “A1”

0.22

× 45°

CHAMFER

DETAIL A

0.630

±0.025 SQ. 108x

S

Y

X

eee

LGA Package

108-Lead (15mm

× 11.25mm × 2.32mm)

(Reference LTC DWG # 05-08-1757 Rev Ø)