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APTGT50TL60T3G 数据表(PDF) 4 Page - Microsemi Corporation |
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APTGT50TL60T3G 数据表(HTML) 4 Page - Microsemi Corporation |
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4 / 7 page ![]() APTGT50TL60T3G www.microsemi.com 4- 7 Thermal and package characteristics Symbol Characteristic Min Typ Max Unit VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V TJ Operating junction temperature range -40 175 TSTG Storage Temperature Range -40 125 TC Operating Case Temperature -40 100 °C Torque Mounting torque To heatsink M4 2.5 4.7 N.m Wt Package Weight 110 g SP3 Package outline (dimensions in mm) 12 1 See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com Q1 to Q4 Typical performance curve Hard switching 0 20 40 60 80 0 2040 6080 I C (A) V CE=300V D=50% R G=8.2Ω T J=150°C T c=85°C Operating Frequency vs Collector Current |
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