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TMC3003 数据表(PDF) 11 Page - Cadeka Microcircuits LLC. |
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TMC3003 数据表(HTML) 11 Page - Cadeka Microcircuits LLC. |
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11 / 12 page ![]() PRODUCT SPECIFICATION TMC3003 REV. 1.0.3 3/5/01 11 Mechanical Dimensions – 48-Lead LQFP Package D E1 E e PIN 1 IDENTIFIER B Base Plane Seating Plane See Lead Detail C 0.063" Ref (1.60mm) L -C- ccc C LEAD COPLANARITY A2 A A1 α A .055 .063 1.40 1.60 Symbol Inches Min. Max. Min. Max. Millimeters Notes A1 .001 .005 .05 .15 .057 1.45 A2 .053 1.35 B .006 .010 .17 .27 D/E D1/E1 .019 BSC .346 .362 8.8 9.2 .268 .284 6.8 7.2 .50 BSC e L .017 .029 .45 .75 6 4 5 2 7 8 α 0 ° 7 ° 0 ° 7 ° N48 48 12 12 ND ccc .004 0.08 Notes: 1. 2. 3. 4. 5. 6. 7. 8. D1 All dimensions and tolerances conform to ANSI Y14.5M-1982. Dimensions "D1" and "E1" do not include mold protrusion. Allowable protrusion is 0.25mm per side. D1 and E1 are maximum plastic body size dimensions including mold mismatch. Pin 1 identifier is optional. Dimension ND: Number of terminals. Dimension ND: Number of terminals per package edge. "L" is the length of terminal for soldering to a substrate. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum B dimension by more than 0.08mm. Dambar can not be located on the lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07mm for 0.4mm and 0.5mm pitch packages. To be determined at seating place —C— |
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