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QPI-9 Data Sheet Rev. 1.3 Page 7 of 8

QPI-9 PCB Layout Recommendations

The filtering performance of the QPI-9 and –10 is

sensitive to capacitive coupling between its input and

output pins. Parasitic plane capacitance must be kept

below 1 pico-Farad between inputs and outputs using

the layout shown above and the recommendations

described below to achieve maximum conducted EMI

performance.

To avoid capacitive coupling between input and output

pins, there should not be any planes or large traces

that run under both input and output pins, such as a

ground plane or power plane. For example, if there

are two signal planes or large traces where one trace

runs under the input pins, and the other under the

output pins, and both planes over-lap in another area,

they will cause capacitive coupling between input and

output pins. Also, planes that run under both input

and outputs pins, but do not cross, can cause capacitive

coupling if they are capacitively by-passed together.

Figure 17 shows the recommended pcb layout on a 2

layer board. Here, the top layer planes are duplicated

on the bottom layer so that there can be no over-

lapping of input and output planes. This method can

be used for boards of greater layer count.

Figure 14 – SiP package mechanicals; LGA pad, package height

and pad location dimensions – inches.

Figure 16 – Recommended PCB receiving footprint.

Figure 17 – Recommended PCB layout on a 2 layer board

Figure 15 – Recommended PCB Receiving Pattern.

Mechanical & Layout Information

Ordering Information

Part

Number

Description

QPI-9LZ

QPI-9 LGA Package, RoHS Compliant

QPI-9LZ-01

QPI-9 LGA, RoHS Compliant

Open Frame Package

Picor lidded QP SIPs are not hermetically sealed and must

not be exposed to liquid, including but not limited to

cleaning solvents, aqueous washing solutions or

pressurized sprays.

When soldering, it is recommended that no-clean flux

solder be used, as this will insure that potentially

corrosive mobile ions will not remain on, around, or

under the module following the soldering process.

For applications requiring water wash compatibility the

“–01” open frame version should be used.

Post Solder Cleaning