AD8465

Rev. 0 | Page 14 of 16

OUTLINE DIMENSIONS

*1.65

1.50 SQ

1.35

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1

EXCEPT FOR EXPOSED PAD DIMENSION.

1

0.50

BSC

0.50

0.40

0.30

0.25 MIN

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

12

4

10

6

7

9

3

COPLANARITY

0.08

EXPOSED

PAD

(BOTTOM

VIEW)

SEATING

PLANE

3.15

3.00 SQ

2.85

2.95

2.75 SQ

2.55

PIN 1

INDICATOR

0.60 MAX

0.60 MAX

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 26. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-12-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

AD8465WBCPZ-WP1

−40°C to +125°C

12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-12-3

Y24

AD8465WBCPZ-R71

−40°C to +125°C

12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-12-3

Y24