ADL5331

Rev. 0 | Page 16 of 16

OUTLINE DIMENSIONS

*COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2

EXCEPT FOR EXPOSED PAD DIMENSION

1

24

6

7

13

19

18

12

*2.45

2.30 SQ

2.15

0.60 MAX

0.50

0.40

0.30

0.30

0.23

0.18

2.50 REF

0.50

BSC

12° MAX

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

1.00

0.85

0.80

SEATING

PLANE

PIN 1

INDICATOR

TOP

VIEW

3.75

BSC SQ

4.00

BSC SQ

PIN 1

INDICATOR

0.60 MAX

COPLANARITY

0.08

0.20 REF

0.23 MIN

EXPOSED

PA D

(BOTTOMVIEW)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 26. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-24-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package

Option

Ordering

Quantity

ADL5331ACPZ-R71

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-24-2

1,500

ADL5331ACPZ-WP1

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-24-2

250

ADL5331-EVALZ1

ADL5331 Evaluation Board

©2009 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D07593-0-5/09(0)