• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

6

HMIC™ Silicon PIN Diode Switches

RoHS Compliant

Rev. V7

MA4SW110

MA4SW210

MA4SW310

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Wire Bonding

Thermosonic wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended. A

heat stage temperature of 150

necessary, it should be adjusted to the minimum level required to achieve a good bond. RF bond wires should

be kept as short as possible.

Chip Mounting

The HMIC switches have Ti-Pt-Au back metal.

They can be die mounted with a gold-tin eutectic solder

preform or conductive epoxy. Mounting surface must be clean and flat.

Eutectic Die Attachment: An 80/20, gold-tin, eutectic solder preform is recommended with a work surface

temperature of 255

chip should be 290

20 seconds. No more than three seconds should be required for attachment. Solders rich in tin should not be

used.

Epoxy Die Attachment: A minimum amount of epoxy, 1-2 mils thick, should be used to attach chip. A thin

epoxy fillet should be visible around the outer perimeter of the chip after placement. Cure epoxy per product

instructions. Typically 150°C for 1 hour.

MA4SW110 Chip Outline Drawing

DIM

INCHES

MM

MIN.

MAX.

MIN.

MAX.

A

0.014

0.018

0.35

0.45

B

0.025

0.029

0.64

0.74

C

0.008 REF

0.20 REF

D

0.004

0.006

0.10

0.15

E

0.004 REF

0.10 REF

F

0.003 REF

0.08 REF

G

0.003 REF

0.08 REF

H

0.020 REF

0.52 REF

Notes:

1.

Topside and backside metallization is gold , 2.5µm thick typical.

2.

Yellow areas indicate wire bonding pads