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MCP616 数据表(PDF) 23 Page - Microchip Technology |
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MCP616 数据表(HTML) 23 Page - Microchip Technology |
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23 / 38 page ![]() © 2008 Microchip Technology Inc. DS21613C-page 23 MCP616/7/8/9 6.0 PACKAGING INFORMATION 6.1 Package Marking Information XXXXXXXX XXXXXNNN YYWW 8-Lead PDIP (300 mil) Examples: 8-Lead SOIC (150 mil) Examples: XXXXXXXX XXXXYYWW NNN MCP616 I/P ^^ 256 0812 MCP616I SN^^ 0812 256 8-Lead MSOP Example: XXXXXX YWWNNN 616I 812256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note : In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e MCP616 I/P256 0812 MCP616 I/SN0812 256 OR OR 3 e |
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