MCP1702-1502ESLASHMB datasheet(3/32 Pages) MICROCHIP

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DS22008D-page 3

MCP1702

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

VDD...............................................................................+14.5V

All inputs and outputs w.r.t. .............(VSS-0.3V) to (VIN+0.3V)

Peak Output Current ...................................................500 mA

Storage temperature .....................................-65°C to +150°C

Maximum Junction Temperature ................................... 150°C

ESD protection on all pins (HBM;MM)

............... ≥ 4kV; ≥ 400V

† Notice: Stresses above those listed under “Maximum Rat-

ings” may cause permanent damage to the device. This is a

stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational listings of this specification is not implied.

Exposure to maximum rating conditions for extended periods

may affect device reliability.

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise specified, all limits are established for V

IN = VOUT(MAX) + VDROPOUT(MAX), Note 1,

ILOAD = 100 µA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.

Boldface type applies for junction temperatures, T

J of -40°C to +125°C. (Note 7)

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input / Output Characteristics

Input Operating Voltage

VIN

2.7

—

13.2

Note 1

Input Quiescent Current

—2.0

µA

IL = 0 mA

Maximum Output Current

IOUT_mA

250

——

For VR ≥ 2.5V

100

—

For VR < 2.5V, VIN ≥ 2.7V

100

130

—

For VR < 2.5V, VIN ≥ 2.95V

150

200

—

For VR < 2.5V, VIN ≥ 3.2V

200

250

—

For VR < 2.5V, VIN ≥ 3.45V

Output Short Circuit Current

IOUT_SC

—400

—

VIN = VIN(MIN) (Note 1), VOUT = GND,

Current (average current) measured

10 ms after short is applied.

Output Voltage Regulation

VOUT

VR-3.0% VR±0.4% VR+3.0%

Note 2

VR-2.0% VR±0.4% VR+2.0%

VR-1.0% VR±0.4% VR+1.0%

1% Custom

VOUT Temperature

Coefficient

TCVOUT

—

ppm/°C

Note 3

Line Regulation

ΔV

OUT/

(VOUTXΔVIN)

-0.3

±0.1

+0.3

%/V

(VOUT(MAX) + VDROPOUT(MAX))

≤ V

IN ≤ 13.2V, (Note 1)

Load Regulation

ΔV

OUT/VOUT

-2.5

±1.0

+2.5

%IL = 1.0 mA to 250 mA for VR ≥ 2.5V

IL = 1.0 mA to 200 mA for VR < 2.5V,

VIN = 3.45V (Note 4)

Note 1:

The minimum VIN must meet two conditions: VIN ≥ 2.7V and VIN ≥ VOUT(MAX) + VDROPOUT(MAX).

VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V. The

input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or VIN = 2.7V (whichever is greater); IOUT = 100 µA.

TCVOUT = (VOUT-HIGH - VOUT-LOW) *10

6 / (V

R * ΔTemperature), VOUT-HIGH = highest voltage measured over the

temperature range. VOUT-LOW = lowest voltage measured over the temperature range.

Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output

voltage due to heating effects are determined using thermal regulation specification TCVOUT.

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured

value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power

dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained

junction temperatures above 150°C can impact the device reliability.

The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the

desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the

ambient temperature is not significant.

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