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MCP4142T-103E/ML 数据表(PDF) 27 Page - Microchip Technology |
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MCP4142T-103E/ML 数据表(HTML) 27 Page - Microchip Technology |
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27 / 88 page  © 2008 Microchip Technology Inc. DS22059B-page 27 MCP414X/416X/424X/426X 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. Additional descriptions of the device pins follows. TABLE 3-1: PINOUT DESCRIPTION FOR THE MCP414X/416X/424X/426X Pin Weak Pull-up/ down (Note 2) Standard Function Single Dual Symbol I/O Buffer Type Rheo Pot (1) Rheo Pot 8L 8L 10L 14L 16L 1 111 16 CS I HV w/ST “smart” SPI Chip Select Input 2 2 2 2 1 SCK I HV w/ST “smart” SPI Clock Input 3 — 3 3 2 SDI I HV w/ST “smart” SPI Serial Data Input — 3 — — — SDI/SDO I/O HV w/ST “smart” SPI Serial Data Input/Output (Note 1, Note 3) 4 444 3, 4 VSS —P — Ground — — 5 5 5 P1B A Analog No Potentiometer 1 Terminal B — — 6 6 6 P1W A Analog No Potentiometer 1 Wiper Terminal — — — 7 7 P1A A Analog No Potentiometer 1 Terminal A — 5 — 8 8 P0A A Analog No Potentiometer 0 Terminal A 5 6 7 9 9 P0W A Analog No Potentiometer 0 Wiper Terminal 6 7 8 10 10 P0B A Analog No Potentiometer 0 Terminal B —— — 11 12 WP I I “smart” Hardware EEPROM Write Protect — — — 12 13 SHDN I HV w/ST “smart” Hardware Shutdown 7 — 9 13 14 SDO O O No SPI Serial Data Out 8 8 10 14 15 VDD —P — Positive Power Supply Input — ——— 11 NC — — — No Connection 99 11 — 17 EP — — — Exposed Pad. (Note 4) Legend: HV w/ST = High Voltage tolerant input (with Schmidtt trigger input) A = Analog pins (Potentiometer terminals) I = digital input (high Z) O = digital output I/O = Input / Output P = Power Note 1: The 8-lead Single Potentiometer devices are pin limited so the SDO pin is multiplexed with the SDI pin (SDI/SDO pin). After the Address/Command (first 6-bits) are received, If a valid Read command has been requested, the SDO pin starts driving the requested read data onto the SDI/SDO pin. 2: The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and shut- down current. 3: The SDO is an open drain output, which uses the internal “smart” pull-up. The SDI input data rate can be at the maximum SPI frequency. the SDO output data rate will be limited by the “speed” of the pull-up, customers can increase the rate with external pull-up resistors. 4: The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively connected to the die substrate, and therefore should be unconnected or connected to the same ground as the device’s VSS pin. |
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