© 2009 Microchip Technology Inc.

DS22151A-page 17

25XX080C/D

8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located with the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

8

Pitch

e

.100 BSC

Top to Seating Plane

A

–

–

.210

Molded Package Thickness

A2

.115

.130

.195

Base to Seating Plane

A1

.015

–

–

Shoulder to Shoulder Width

E

.290

.310

.325

Molded Package Width

E1

.240

.250

.280

Overall Length

D

.348

.365

.400

Tip to Seating Plane

L

.115

.130

.150

Lead Thickness

c

.008

.010

.015

Upper Lead Width

b1

.040

.060

.070

Lower Lead Width

b

.014

.018

.022

Overall Row Spacing §

eB

–

–

.430

N

E1

NOTE 1

D

12

3

A

A1

A2

L

b1

b

e

E

eB

c

Microchip Technology Drawing C04-018B