© 2009 Microchip Technology Inc.

DS22184A-page 27

24AA32AF/24LC32AF

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

X

/XX

Package

Temperature

Range

Device

Device:

with half-array write-protect

with half-array write-protect (Tape and Reel)

with half-array write-protect

with half-array write-protect (Tape and Reel)

Temperature

Range:

I

=

-40°C to +85°C

E

=

-40°C to +125°C

Package:

P

=

Plastic DIP (300 mil body), 8-lead

SN

=

Plastic SOIC (3.90 mm body), 8-lead

ST

=

Plastic TSSOP (4.4 mm), 8-lead

MS

=

Plastic Micro Small Outline (MSOP), 8-lead

OT

=

SOT-23 (Tape and Reel only), 5-lead

Examples:

a)

24AA32AF-I/P: Industrial Temperature,1.7V,

PDIP package

b)

24AA32AF-I/SN: Industrial Temperature,1.7V,

SOIC package

c)

24AA32AF-I/SM: Industrial Tempera-

ture.,1.7V, SOIC (5.28 mm) package

d)

24AA32AF-I/ST: Industrial Temperature.,1.7V,

TSSOP package

e)

24LC32AF-I/P: Industrial Temperature, 2.5V,

PDIP package

f)

24LC32AF-E/SN: Automotive Temperature,

2.5V SOIC package

g)

24LC32AF-E/SM: Automotive Temperature,

2.5V SOIC (5.28 mm) package

h)

24LC32AFT-I/ST: Industrial Temperature,

2.5V, TSSOP package, Tape and Reel

Note 1:

“Y” indicates a Nickel Palladium Gold (NiPdAu) finish.