MCP662-ESLASHMF datasheet(29/42 Pages) MICROCHIP

29 / 42 page

DS22194A-page 29

MCP661/2/3/5

6.0

PACKAGING INFORMATION

6.1

Package Marking Information

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

8-Lead SOIC (150 mil) (MCP661, MCP662, MCP663)

Example

XXXXXXXX

XXXXYYWW

NNN

MCP661E

0924

256

8-Lead DFN (3×3) (MCP662)

Example

Device

Code

MCP662

DABQ

Note:

Applies to 8-Lead 3x3 DFN

10-Lead MSOP (MCP665)

Example

665EUN

924256

XXXXXX

YWWNNN

10-Lead DFN (3×3) (MCP665)

Example

Device

Code

MCP665

BAFD

Note:

Applies to 10-Lead 3x3 DFN

XXXX

YYWW

NNN

DABQ

0924

256

XXXX

YYWW

NNN

BAFD

0924

256

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