MCP662-ESLASHMF datasheet(19/42 Pages) MICROCHIP

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DS22194A-page 19

MCP661/2/3/5

3.0

PIN DESCRIPTIONS

Descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

3.1

Analog Outputs

The analog output pins (VOUT) are low-impedance

voltage sources.

3.2

Analog Inputs

The non-inverting and inverting inputs (VIN+, VIN–, …)

are high-impedance CMOS inputs with low bias

currents.

3.3

Power Supply Pins

The positive power supply (VDD) is 2.5V to 5.5V higher

than the negative power supply (VSS). For normal

operation, the other pins are between VSS and VDD.

Typically, these parts are used in a single (positive)

supply configuration. In this case, VSS is connected to

ground and VDD is connected to the supply. VDD will

need bypass capacitors.

3.4

Chip Select Digital Input (CS)

This input (CS) is a CMOS, Schmitt-triggered input that

places the part into a low power mode of operation.

3.5

Exposed Thermal Pad (EP)

There is an internal connection between the Exposed

Thermal Pad (EP) and the VSS pin; they must be

connected to the same potential on the Printed Circuit

Board (PCB).

This pad can be connected to a PCB ground plane to

provide a larger heat sink. This improves the package

thermal resistance (

θJA).

MCP661

MCP662

MCP663

MCP665

Symbol

Description

SOIC

DFN

SOIC

MSOP

DFN

VOUT, VOUTA

Output (op amp A)

VIN–, VINA–

Inverting Input (op amp A)

VIN+, VINA+

Non-inverting Input (op amp A)

VSS

Negative Power Supply

——

—

CS, CSA

Chip Select Digital Input (op amp A)

——

—

CSB

Chip Select Digital Input (op amp B)

—5

—

VINB+

Non-inverting Input (op amp B)

—6

—

VINB–

Inverting Input (op amp B)

—7

—

VOUTB

Output (op amp B)

VDD

Positive Power Supply

1,5,8

—

1,5

—

No Internal Connection

—

Exposed Thermal Pad (EP);

must be connected to VSS

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