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MCP9804-E/MS 数据表(PDF) 35 Page - Microchip Technology |
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MCP9804-E/MS 数据表(HTML) 35 Page - Microchip Technology |
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35 / 54 page ![]() © 2009 Microchip Technology Inc. DS22203A-page 35 MCP9804 6.0 APPLICATIONS INFORMATION 6.1 Layout Considerations The MCP9804 does not require any additional components besides the master controller in order to measure temperature. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. A high-frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the power and ground pins of the device in order to provide effective noise protection. In addition, good PCB layout is key for better thermal conduction from the PCB temperature to the sensor die. For good temperature sensitivity, add a ground layer under the device pins as shown in Figure 6-1. 6.2 Thermal Considerations A potential for self-heating errors can exist if the MCP9804 SDA, SCL and Event lines are heavily loaded with pull-ups (high current). Typically, the self-heating error is negligible because of the relatively small current consumption of the MCP9804. A temperature accuracy error of approximately 0.5°C could result from self-heating if the communication pins sink/source the maximum current specified. For example, if the Event output is loaded to maximum IOL, Equation 6-1 can be used to determine the effect of self-heating. EQUATION 6-1: EFFECT OF SELF-HEATING At room temperature (TA = +25°C) with maximum IDD = 500 µA and VDD = 3.6V, the self-heating due to power dissipation TΔ is 0.2°C for the DFN-8 package and 0.5°C for the TSSOP-8 package. FIGURE 6-1: DFN Package Layout (Top View). TΔ θ JA V DD I DD V OL_Alert I OL_Alert V OL_SDA I OL_SDA • + • + • () = Where: TΔ =TJ - TA TJ = Junction Temperature TA = Ambient Temperature θ JA = Package Thermal Resistance VOL_Alert, SDA = Alert and SDA Output VOL (0.4 Vmax) IOL_Alert, SDA = Alert and SDA Output IOL (3 mAmax) SDA SCL Alert GND VDD A0 A1 A2 EP9 |
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