MPC5604B datasheet(21/72 Pages) FREESCALE

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Electrical characteristics

MPC5604B/C Microcontroller Data Sheet, Rev. 4

Freescale Semiconductor

4.7.5

I/O pad current specification

The I/O pads are distributed across the I/O supply segment. Each I/O supply segment is associated to a VDD/VSS supply pair as

described in Table 17.

Table 18 provides I/O consumption figures.

In order to ensure device reliability, the average current of the I/O on a single segment should remain below the IAVGSEG

maximum value.

In order to ensure device functionality, the sum of the dynamic and static current of the I/O on a single segment should remain

below the IDYNSEG maximum value.

Ttr CC D Output transition time output pin

(3)

FAST configuration

CL = 25 pF

VDD = 5.0 V ± 10%,

PAD3V5V = 0

—

CL = 50 pF

—

CL = 100 pF

—

CL = 25 pF

VDD = 3.3 V ± 10%,

PAD3V5V = 1

—

CL = 50 pF

—

CL = 100 pF

—

1 V

DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C, unless otherwise specified

2 All values need to be confirmed during device validation.

3 C

L includes device and package capacitances (CPKG < 5 pF).

Table 17. I/O supply segment

Package

Supply segment

208 MAPBGA1

1 208 MAPBGA available only as development package for Nexus2+

Equivalent to 144 LQFP segment pad distribution

MCKO

MDOn/MSEO

144 LQFP

pin20–pin49

pin51–pin99

pin100–pin122 pin 123–pin19

—

100 LQFP

pin16–pin35

pin37–pin69

pin70–pin83

pin 84–pin15

—

Table 16. Output pin transition times (continued)

Symbol

Parameter

Conditions1

Value2

Unit

Min

Typ

Max

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