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DA1634.001

28 November, 2008

MAS1634 PAD LAYOUT

VDD1

XPD

IN1

IN2

IN3

IN4

VDD2

GND1

DUMMY

OUT1

OUT2

OUT3

OUT4

GND2

1580 µm (X-scribe line width 100 µm)

MAS1634

DIE size = 1.58 mm x 1.66 mm; PAD size = 90 µm x 90 µm

Note:

Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left

floating. Please make sure that GND1 and GND2 are the first pads to be bonded. Pick-and-place and all

component assembly are recommended to be performed in ESD protected area.

MAS1634 PAD COORDINATES

Note:

Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die.

Pad Identification

Name

X-coordinate

Y-coordinate

Note

Positive Power Supply

VDD1

158 µm

1435 µm

1

Power Down Input

XPD

158 µm

1225 µm

3

LED Current Driver Input 1

IN1

158 µm

1014 µm

4

LED Current Driver Input 2

IN2

158 µm

814 µm

4

LED Current Driver Input 3

IN3

158 µm

603 µm

4

LED Current Driver Input 4

IN4

158 µm

392 µm

4

Positive Power Supply

VDD2

158 µm

182 µm

1

Power Supply Ground

GND1

1422 µm

1435 µm

2

Unused Dummy Pad

DUMMY

1422 µm

1225 µm

5

LED Current Driver Output 1

OUT1

1422 µm

1014 µm

LED Current Driver Output 2

OUT2

1422 µm

814 µm

LED Current Driver Output 3

OUT3

1422 µm

603 µm

LED Current Driver Output 4

OUT4

1422 µm

392 µm

Power Supply Ground

GND2

1422 µm

182 µm

2

Notes:

1) Keep VDD1 and VDD2 in same potential since both are internally connected together. Due to internal

connection it is only necessary to connect at least one of the two VDD pins to supply voltage.

2) Keep GND1 and GND2 in same potential since both are internally connected together. Due to internal

connection it is only necessary to connect at least one of the two GND pins to supply ground.

3) Power down mode when XPD is low and operating mode when XPD is high.

4) Each led driver input has 1.7MΩ ± 15% pull-down resistor but which are in an inactive high impedance state

if the XPD input is low (i.e. power down mode). This is the reason why XPD pin requires external control to

achieve properly controlled operation.

5) Dummy pad is electrically unconnected and its only purpose is to make pad layout symmetrical.