DRV8821 datasheet(4/17 Pages) TI

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ABDECAY

AOUT1

AOUT2

AISEN

ABSTEP

ABUSM0

ABDIR

ABVREF

BISEN

CDVREF

CDDECAY

ABENBLn

V3P3

BOUT2

BOUT1

CDSTEP

CDUSM0

CDDIR

CDENBLn

PGND

Solder these

pins to copper

heatsink area

PGND

VCP

CP2

CP1

DOUT2

DISEN

DOUT1

ABUSM1

ABRESETn

CISEN

COUT2

CDRESETn

COUT1

CDUSM1

PGND

Solder these

pins to copper

heatsink area

ABSOLUTE MAXIMUM RATINGS

(1) (2)

DISSIPATION RATINGS

DRV8821

SLVS912B – JANUARY 2009 – REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com

DCA PACKAGE

over operating free-air temperature range (unless otherwise noted)

Power supply voltage range

–0.3 to 32

Logic input voltage range(3)

–0.5 to 5.75

IO(peak)

Peak motor drive output current, t < 1

µs

Internally limited

Motor drive output current(4)

1.5

Continuous total power dissipation

See Dissipation Ratings Table

Operating virtual junction temperature range

–40 to 150

°C

Operating ambient temperature range

–40 to 85

°C

Tstg

Storage temperature range

–60 to 150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

(3)

Input pins may be driven in this voltage range regardless of presence or absence of VM.

(4)

Power dissipation and thermal limits must be observed.

DERATING FACTOR

BOARD

PACKAGE

RθJA

TA < 25°C

TA = 70°C

TA = 85°C

ABOVE TA = 25°C

Low-K(1)

75.7°C/W

13.2 mW/°C

1.65 W

1.06 W

0.86 W

Low-K(2)

32°C/W

31.3 mW/°C

3.91 W

2.50 W

2.03 W

DCA

High-K(3)

30.3°C/W

33 mW/°C

4.13 W

2.48 W

2.15 W

High-K(4)

22.3°C/W

44.8 mW/°C

5.61 W

3.59 W

2.91 W

(1)

The JEDEC Low-K board used to derive this data was a 76-mm x 114-mm, 2-layer, 1.6-mm thick PCB with no backside copper.

(2)

The JEDEC Low-K board used to derive this data was a 76-mm x 114-mm, 2-layer, 1.6-mm thick PCB with 25-cm2 2-oz copper on back

side.

(3)

The JEDEC High-K board used to derive this data was a 76-mm x 114-mm, 4-layer, 1.6-mm thick PCB with no backside copper and

solid 1-oz internal ground plane.

(4)

The JEDEC High-K board used to derive this data was a 76-mm x 114-mm, 4-layer, 1.6-mm thick PCB with 25-cm2 1-oz copper on back

side and solid 1-oz internal ground plane.

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