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CPC5602 数据表(PDF) 3 Page - Clare, Inc.

部件名 CPC5602
功能描述  N Channel Depletion Mode FET
PDF  3 Pages
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制造商  CLARE [Clare, Inc.]
网页  http://www.clare.com
标志 CLARE - Clare, Inc.

CPC5602 数据表(HTML) 3 Page - Clare, Inc.

  CPC5602 Datasheet HTML 1Page - Clare, Inc. CPC5602 Datasheet HTML 2Page - Clare, Inc. CPC5602 Datasheet HTML 3Page - Clare, Inc.  
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Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications
intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare,
Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC5602-R05
©Copyright 2008, Clare, Inc.
All rights reserved. Printed in USA.
9/30/08
For additional information please visit our website at: www.clare.com
CPC5602
3
MECHANICAL DIMENSIONS
RoHS
2002/95/EC
e3
Pb
MANUFACTURING INFORMATION
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
SOT-223 Package
Recommended PCB Land Pattern
Dimensions
mm
(inches)
7.00 ± 0.38
(0.276 ± 0.015)
0.31 ± 0.07
(0.012 ± 0.003)
0.80 ± 0.127
(0.031 ± 0.005)
1.90
(0.075)
1.90
(0.075)
6.20
(0.244)
2.30
(0.0905)
0.95
(0.0374)
3.15
(0.124)
6.50 ± 0.20
(0.256 ± 0.008)
1.85 MAX
(0.073 MAX)
1.60 ± 0.10
(0.063 ± 0.004)
2.30 ± 0.10
(0.0905 ± 0.004)
3.50 ± 0.20
(0.138 ± 0.008)
3.05 ± 0.10
(0.120 ± 0.004)
0.75 ± 0.04
(0.029 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
1.75 Nom
(0.069 Nom)
0.051 +0.076/-0.051
(0.002 +0.003/-0.002)
K
O=1.956 MAX.
(0.077 MAX.)
P=8.0 ± 0.1
(0.315 ± 0.004)
A
O=7.0 ± 0.1
(0.276 ± 0.004)
B
O=7.5 ± 0.1
(0.295 ± 0.004)
W=16.0 ± 0.3
(0.630 ± 0.012)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
7” Tape and Reel Packaging for the SOT-223 Package
Dimensions
mm
(inches)
Embossment
Embossed
Carrier
177.8 Dia
(7.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)



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