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CPC7581MATR 数据表(PDF) 15 Page - Clare, Inc. |
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CPC7581MATR 数据表(HTML) 15 Page - Clare, Inc. |
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15 / 17 page ![]() CPC7581 R05 www.clare.com 15 3.2 Printed-Circuit Board Layout 3.2.1 SOIC 3.2.2 DFN As the metallic pad on the bottom of the DFN package is connected to the substrate of the die, Clare recommends that no printed circuit board traces or vias be placed under this area. 2.00 (0.079) 1.27 (0.050) mm (inches) DIMENSIONS 9.40 (0.370) 0.60 (0.024) DIMENSIONS mm (inches) 5.80 (0.228) 0.35 (0.014) 1.05 (0.041) 0.80 (0.031) |
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