CPC7582

R05

www.clare.com

19

3.3.2 16-Pin DFN

3.4 Soldering

3.4.1 Moisture Reflow Sensitivity

Clare has characterized the moisture reflow sensitivity

for this product using IPC/JEDEC standard

J-STD-020. Moisture uptake from atmospheric

humidity occurs by diffusion. During the solder reflow

process, in which the component is attached to the

PCB, the whole body of the component is exposed to

high process temperatures. The combination of

moisture uptake and high reflow soldering

temperatures may lead to moisture induced

delamination and cracking of the component. To

prevent this, this component must be handled in

accordance with IPC/JEDEC standard J-STD-033 per

the labeled moisture sensitivity level (MSL), level 1 for

the SOIC package, and level 3 for the DFN package.

3.4.2 Reflow Profile

For proper assembly, this component must be

processed in accordance with the current revision of

IPC/JEDEC standard J-STD-020. Failure to follow the

recommended guidelines may cause permanent

damage to the device resulting in impaired

performance and/or a reduced lifetime expectancy.

3.5 Washing

Clare does not recommend ultrasonic cleaning of this

part.

NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2

Dimensions

mm

(inches)

Embossment

Embossed

Carrier

330.2 Dia

(13.00 Dia)

Top Cover

Tape Thickness

0.102 Max

(0.004 Max)

K

(0.063 + 0.004)

B

(0.285 + 0.004)

W=16.00 + 0.30

(0.630 + 0.012)

P=12.00 + 0.10

(0.472 + 0.004)

A

(0.246 + 0.004)

Pin 1

User Direction of Feed

RoHS

2002/95/EC

Pb

For additional information please visit www.clare.com

Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set

forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its

products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into

the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a

person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.

Specifications: DS-CPC7582-R05

© Copyright 2009, Clare, Inc.

All rights reserved. Printed in USA.

10/14/09