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LM5033MM 数据表(PDF) 2 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部件名 LM5033MM
功能描述  100V Push-Pull Voltage Mode PWM Controller
PDF  17 Pages
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制造商  NSC [National Semiconductor (TI)]
网页  http://www.national.com
标志 NSC - National Semiconductor (TI)

LM5033MM 数据表(HTML) 2 Page - National Semiconductor (TI)

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Pin Description
PIN
NAME
DESCRIPTION
APPLICATION INFORMATION
1
Vin
Input Voltage
Input to the start-up regulator. Input range is 15V to
90V, with transient capability to 100V .
2
REF
2.5V precision reference output
Sink only, requires an external pull-up resistor. This
can be used as a reference for external circuitry.
3
COMP
PWM Input
Feedback to the PWM comparator’s inverting input,
through a 3:1 divider. The output duty cycle increases
as this pin’s voltage increases. Internally there is a
5k
Ω pullup to +5.2V.
4
VCC
9.6V output from the internal high voltage series
pass regulator
An external voltage (10V - 15V) can be applied to this
pin to shutdown the internal regulator, thereby
reducing internal dissipation. An internal diode
connects Vcc to Vin.
5
OUT1
Gate Driver Output #1
Alternating output gate driver, which can source and
sink 1.5A.
6
OUT2
Gate Driver Output #2
Alternating output gate driver, which can source and
sink 1.5A.
7
GND
Ground pin for all internal circuitry
Connections to external ground must be done with
care for optimum performance. See the Functional
Description and Applications Section for more
information.
8
CS
Current sense input
Current sense input for the current limit detection. If
CS exceeds 0.5V the outputs are disabled and the
softstart pin is discharged to ground.
9R
T/ SYNC
Oscillator timing resistor pin and synchronization
input
An external resistor to ground sets the oscillator
frequency. This pin will also accept ac-coupled
synchronization pulses from an external source.
10
SS
Softstart pin
An internal 10µA current source and an external
capacitor set the soft-start timing. This pin can be
externally pulled to below 0.5V to disable the output
drivers.
LLP
DAP
SUB
Die Substrate
The exposed die attach pad on the LLP package
should be connected to a PCB thermal pad at ground
potential. For additional information on using National
Semiconductor’s No Pull Back LLP package, please
refer to LLP Application Note AN-1187.
www.national.com
2



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