ADP5022

Rev. A | Page 25 of 28

OUTLINE DIMENSIONS

A

B

C

D

0.660

0.602

0.544

2.12

2.08 SQ

2.04

0.380

0.352

0.324

1

2

3

4

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

0.280

0.250

0.220

0.330

0.310

0.290

BALL 1

IDENTIFIER

SEATING

PLANE

0.04 NOM

COPLANARITY

0.50

REF

0.022

REF

1.50

REF

Figure 57. 16-Ball Wafer Level Chip Scale Package [WLCSP]

Back-Coating Included

(CB-16-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Output

Voltage (V)1

Undervoltage

Lockout Level

Temperature

Range

Package Description

Package

Option

Branding

Code

ADP5022ACBZ-1-R72

VOUT1 = 3.3 V

VOUT2 = 1.5 V

VOUT3 = 1.8 V

Low

−40°C to +125°C

16-Ball Wafer Level Chip Scale Package [WLCSP]

CB-16-7

L9H

ADP5022ACBZ-2-R72

VOUT1 = 1.2 V

VOUT2 = 1.8 V

VOUT3 = 2.8 V

Low

−40°C to +125°C

16-Ball Wafer Level Chip Scale Package [WLCSP]

CB-16-7

L9J

ADP5022ACBZ-4-R72

VOUT1 = 3.3 V

VOUT2 = 1.8 V

VOUT3 = 3.3 V

High

−40°C to +125°C

16-Ball Wafer Level Chip Scale Package [WLCSP]

CB-16-7

LG7

Buck1 and Buck2: 3.3 V, 3.0 V, 2.8 V, 2.5 V, 2.3 V, 2.0 V, 1.82 V, 1.8 V, 1.6 V, 1.5 V, 1.3 V, 1.2 V, 1.1 V, 1.0 V, 0.9 V, 0.8 V

LDO: 3.3 V, 3.0 V, 2.9 V, 2.8 V, 2.775 V, 2.5 V, 2.0 V, 1.875 V, 1.8 V, 1.75 V, 1.7 V, 1.65 V, 1.6 V, 1.55 V, 1.5 V, 1.2 V

UVLO: 2.25 V or 3.9 V