MCP6281-ESLASHMS datasheet(4/36 Pages) MICROCHIP

4 / 36 page

MCP6281/1R/2/3/4/5

DS21811E-page 4

TEMPERATURE SPECIFICATIONS

1.1

Test Circuits

The test circuits used for the DC and AC tests are

shown in Figure 1-2 and Figure 1-2. The bypass

capacitors are laid out according to the rules discussed

in Section 4.6 “Supply Bypass”.

FIGURE 1-2:

AC and DC Test Circuit for

Most Non-Inverting Gain Conditions.

FIGURE 1-3:

AC and DC Test Circuit for

Most Inverting Gain Conditions.

Electrical Characteristics: Unless otherwise indicated, VDD = +2.2V to +5.5V and VSS = GND.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Operating Temperature Range

-40

—

+125

°C

Note

Storage Temperature Range

-65

—

+150

°C

Thermal Package Resistances

Thermal Resistance, 5L-SOT-23

—

256

—

°C/W

Thermal Resistance, 6L-SOT-23

—

230

—

°C/W

Thermal Resistance, 8L-PDIP

—85

—

°C/W

Thermal Resistance, 8L-SOIC

—

163

—

°C/W

Thermal Resistance, 8L-MSOP

—

206

—

°C/W

Thermal Resistance, 14L-PDIP

—

°C/W

Thermal Resistance, 14L-SOIC

—

120

—

°C/W

Thermal Resistance, 14L-TSSOP

—

100

—

°C/W

Note:

The Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C.

VDD

MCP628X

VOUT

VIN

VDD/2

1µF

0.1 µF

VDD

MCP628X

VOUT

VDD/2

VIN

1µF

0.1 µF

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