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LTC3633 数据表(PDF) 21 Page - Linear Technology

部件名 LTC3633
功能描述  Dual Channel 3A, 15V Monolithic Synchronous Step-Down Regulator
PDF  28 Pages
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制造商  LINER [Linear Technology]
网页  http://www.linear.com
标志 LINER - Linear Technology

LTC3633 数据表(HTML) 21 Page - Linear Technology

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LTC3633
21
3633f
of power loss in the package with corresponding output
load current. Although making this measurement with this
method does violate absolute maximum voltage ratings
on the PGOOD pin, the applied power is so low that there
should be no significant risk of damaging the device.
Board Layout Considerations
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3633. Check the following in your layout:
1) Do the input capacitors connect to the VIN and PGND
pins as close as possible? These capacitors provide
the AC current to the internal power MOSFETs and their
drivers.
2) The output capacitor, COUT, and inductor L should be
closely connected to minimize loss. The (–) plate of
COUT should be closely connected to both PGND and
the (–) plate of CIN.
3) The resistive divider, (e.g. R1 to R4 in Figure 8) must be
connected between the (+) plate of COUT and a ground
line terminated near SGND. The feedback signal VFB
should be routed away from noisy components and
traces, such as the SW line, and its trace length should
be minimized. In addition, the RT resistor and loop
compensation components should be terminated to
SGND.
4) Keep sensitive components away from the SW pin.
The RT resistor, the compensation components, the
feedback resistors, and the INTVCC bypass capacitor
should all be routed away from the SW trace and the
inductor L.
5) A ground plane is preferred, but if not available, the
signal and power grounds should be segregated with
both connecting to a common, low noise reference point.
The connection to the PGND pin should be made with
a minimal resistance trace from the reference point.
APPLICATIONS INFORMATION
6) Flood all unused areas on all layers with copper in order
to reduce the temperature rise of power components.
These copper areas should be connected to the exposed
backside of the package (PGND).
Refer to Figures 9 and 10 for board layout examples.
Design Example
As a design example, consider using the LTC3633 in an
application with the following specifications: VIN(MAX)
= 13.2V, VOUT1 = 1.8V, VOUT2 = 3.3V, IOUT(MAX) = 3A,
IOUT(MIN) = 10mA, f = 2MHz, VDROOP ~ (5% • VOUT). The
following discussion will use equations from the previous
sections.
Because efficiency is important at both high and low load
current, Burst Mode operation will be utilized.
First, the correct RT resistor value for 2MHz switching fre-
quency must be chosen. Based on the equation discussed
earlier, RT should be 160k; the closest standard value is
162k. RT can be tied to INTVCC if switching frequency
accuracy is not critical.
Next, determine the channel 1 inductor value for about
40% ripple current at maximum VIN:
L1=
1.8V
2MHz • 1.2A
1
1.8V
13.2V
= 0.64μH
A standard value of 0.68μH should work well here. Solv-
ing the same equation for channel 2 results in a 1μH
inductor.
COUT will be selected based on the charge storage require-
ment. For a VDROOP of 90mV for a 3A load step:
C
OUT1
3• ΔIOUT
f
0 VDROOP
=
3• (3A)
(2MHz)(90mV)
= 50μF



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