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LTC3633 数据表(PDF) 21 Page - Linear Technology |
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LTC3633 数据表(HTML) 21 Page - Linear Technology |
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21 / 28 page ![]() LTC3633 21 3633f of power loss in the package with corresponding output load current. Although making this measurement with this method does violate absolute maximum voltage ratings on the PGOOD pin, the applied power is so low that there should be no significant risk of damaging the device. Board Layout Considerations When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC3633. Check the following in your layout: 1) Do the input capacitors connect to the VIN and PGND pins as close as possible? These capacitors provide the AC current to the internal power MOSFETs and their drivers. 2) The output capacitor, COUT, and inductor L should be closely connected to minimize loss. The (–) plate of COUT should be closely connected to both PGND and the (–) plate of CIN. 3) The resistive divider, (e.g. R1 to R4 in Figure 8) must be connected between the (+) plate of COUT and a ground line terminated near SGND. The feedback signal VFB should be routed away from noisy components and traces, such as the SW line, and its trace length should be minimized. In addition, the RT resistor and loop compensation components should be terminated to SGND. 4) Keep sensitive components away from the SW pin. The RT resistor, the compensation components, the feedback resistors, and the INTVCC bypass capacitor should all be routed away from the SW trace and the inductor L. 5) A ground plane is preferred, but if not available, the signal and power grounds should be segregated with both connecting to a common, low noise reference point. The connection to the PGND pin should be made with a minimal resistance trace from the reference point. APPLICATIONS INFORMATION 6) Flood all unused areas on all layers with copper in order to reduce the temperature rise of power components. These copper areas should be connected to the exposed backside of the package (PGND). Refer to Figures 9 and 10 for board layout examples. Design Example As a design example, consider using the LTC3633 in an application with the following specifications: VIN(MAX) = 13.2V, VOUT1 = 1.8V, VOUT2 = 3.3V, IOUT(MAX) = 3A, IOUT(MIN) = 10mA, f = 2MHz, VDROOP ~ (5% • VOUT). The following discussion will use equations from the previous sections. Because efficiency is important at both high and low load current, Burst Mode operation will be utilized. First, the correct RT resistor value for 2MHz switching fre- quency must be chosen. Based on the equation discussed earlier, RT should be 160k; the closest standard value is 162k. RT can be tied to INTVCC if switching frequency accuracy is not critical. Next, determine the channel 1 inductor value for about 40% ripple current at maximum VIN: L1= 1.8V 2MHz • 1.2A 1 1.8V 13.2V = 0.64μH A standard value of 0.68μH should work well here. Solv- ing the same equation for channel 2 results in a 1μH inductor. COUT will be selected based on the charge storage require- ment. For a VDROOP of 90mV for a 3A load step: C OUT1 ≈ 3• ΔIOUT f 0 VDROOP = 3• (3A) (2MHz)(90mV) = 50μF |
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