TPS92001, TPS92002

SLUSA24 – FEBRUARY 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

(1)

RANGE

UNIT

VDD

19

Input voltage range

SS

-0.3 to REF + 0.3

V

RTC, RTD

-0.3 to REF + 0.3

-15

Continuous input current

mA

25

Output current

-0.4 to 0.8

A

Operating junction temperature

−55 to +150

°C

Storage temperature

−65 to +150

Lead temperature

Soldering, 10 s

+300

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages

are with respect to GND. Currents are positive into, negative out of the specified terminal.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

VDD

Input voltage

21

V

Output sink current

0

A

Operating junction temperature

–40

105

°C

DISSIPATION RATINGS

IMPEDANCE

IMPEDANCE

PACKAGE

POWER

POWER

POWER

JUNCTION-TO-AMBIENT,

JUNCTION-TO-BOARD,

RATING (mW)

RATING (mW)

RATING (mW)

NO AIRFLOW (°C/W)

NO AIRFLOW (°C/W)

SOIC-8 (D)

55

MSOP-8 (DGK)

62

(1)

Tested per JEDEC EIA/JESD51-1. Thermal resistance is a function of board construction and layout. Air flow will reduce thermal

resistance. This number is included only as a general guideline; see TI document SPRA953 IC Package Thermal Metrics.

(2)

(3)

measured approximately 1 cm from the lead to board interface. This number is provided only as a general guideline.

ELECTROSTATIC DISCHARGE (ESD) PROTECTION

MIN

MAX

UNIT

Human body model

2000

V

CDM

1500

2

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