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INA333-HT 数据表(PDF) 7 Page - Texas Instruments |
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INA333-HT 数据表(HTML) 7 Page - Texas Instruments |
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7 / 24 page ![]() 1 10 100 1000 10000 100000 1000000 110 130 150 170 190 210 230 Continous TJ (°C) Electromigration Fail Mode Notes 1. See datasheet for absolute maximum and minimum recommended operating conditions. 2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life). www.ti.com SBOS514 – MARCH 2010 ELECTRICAL CHARACTERISTICS: VS = +1.8 V to +5.5 V (continued) At TA = +25°C, RL = 10kΩ, VREF = VS/2, and G = 1, unless otherwise noted. TA = –55°C to +125°C TA = +210°C PARAMETER TEST CONDITIONS MIN TYP MAX MIN TYP MAX UNIT G = 1 VSTEP = 4 V 60 55 ms G = 100 VSTEP = 4 V 500 530 ms Overload recovery 50% overdrive 52 28 ms REFERENCE INPUT RIN 300 300 k Ω Voltage range V– V+ V– V+ V POWER SUPPLY Voltage range Single +1.8 +5.5 +1.8 +5.5 V Dual ±0.9 ±2.75 ±0.9 ±2.75 V Quiescent current IQ VIN = VS/2 50 75 mA vs Temperature 80 198 345 mA TEMPERATURE RANGE Specified temperature –55 +125 –55 +210 °C range Operating temperature –55 +125 –55 +210 °C range Figure 1. INA333SKGD1 Operating Life Derating Chart Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): INA333-HT |
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