Production Data Rev 1.0

WM2616

WOLFSON MICROELECTRONICS LTD

9

PACKAGE DIMENSIONS

DM009.B

D: 8 PIN SOIC 3.9 mm Wide Body

Symbols

Dimensions

(mm)

Dimensions

(Inches)

MIN

MAX

MIN

MAX

A

1.35

1.75

0.0532

0.0688

0.10

0.25

0.0040

0.0098

B

0.33

0.51

0.0130

0.0200

C

0.19

0.25

0.0075

0.0098

D

4.80

5.00

0.1890

0.1968

e

1.27 BSC

0.050 BSC

E

3.80

4.00

0.1497

0.1574

h

0.25

0.50

0.0099

0.0196

H

5.80

6.20

0.2284

0.2440

L

0.40

1.27

0.0160

0.0500

α

α

0

o

8

o

0

o

8

o

REF:

JEDEC.95, MS-012

NOTES:

A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).

B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).

D. MEETS JEDEC.95 MS-012, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.

C

α

L

A

A1

SEATING PLANE

-C-

0.10 (0.004)

4

1

D

5

8

E

H

B

e