WM2633

Production Data

WOLFSON MICROELECTRONICS LTD

PD Rev 1.0 July 1999

12

PACKAGE DIMENSIONS

θ

c

L

GAUGE

PLANE

0.25

NOTES:

A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS.

B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM.

D. MEETS JEDEC.95 MO-153, VARIATION = AC. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.

DM008.C

DT: 20 PIN TSSOP (6.5 x 4.4 x 1.0 mm)

Symbols

Dimensions

(mm)

MIN

NOM

MAX

A

-----

-----

1.20

0.05

-----

0.15

0.80

1.00

1.05

b

0.19

-----

0.30

c

0.09

-----

0.20

D

6.40

6.50

6.60

e

0.65 BSC

E

6.4 BSC

4.30

4.40

4.50

L

0.45

0.60

0.75

θ

0

o

-----

8

o

REF:

JEDEC.95, MO-153

A

A2

A1

SEATING PLANE

-C-

0.05 C

11

20

E1

E

e

b

10

1

D