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AM1808AZCED3 数据表(PDF) 260 Page - Texas Instruments

部件名 AM1808AZCED3
功能描述  AM1808 ARM Microprocessor
PDF  264 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

AM1808AZCED3 数据表(HTML) 260 Page - Texas Instruments

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AM1808
SPRS653A – FEBRUARY 2010 – REVISED APRIL 2010
www.ti.com
8.3
Thermal Data for ZWT Package
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT mechanical
package.
Table 8-2. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
°C/W(1)
AIR FLOW (m/s)(2)
1
R
ΘJC
Junction-to-case
7.3
N/A
2
R
ΘJB
Junction-to-board
12.4
N /A
3
R
ΘJA
Junction-to-free air
23.7
0.00
4
21.0
0.50
5
20.1
1.00
R
ΘJMA
Junction-to-moving air
6
19.3
2.00
7
18.4
4.00
8
0.2
0.00
9
0.3
0.50
10
PsiJT
Junction-to-package top
0.3
1.00
11
0.4
2.00
12
0.5
4.00
13
12.3
0.00
14
12.2
0.50
15
PsiJB
Junction-to-board
12.1
1.00
16
12.0
2.00
17
11.9
4.00
(1)
These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
(2)
m/s = meters per second
260
Mechanical Packaging and Orderable Information
Copyright © 2010, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): AM1808



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