CS4953xx Data Sheet

32-bit Audio Decoder DSP Family

DS705PP6

Copyright 2009 Cirrus Logic

11

5.4 Power Supply Characteristics

(measurements performed under operating conditions)

5.5 Thermal Data (144-pin LQFP)

5.6 Thermal Data (128-pin LQFP)

of the top & bottom layers.

2.

Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20 %

of the top & bottom layers and 0.5-oz copper covering 90 % of the internal power plane and ground plane layers.

3.

To calculate the die temperature for a given power dissipation

Τ

θ

4.

To calculate the case temperature for a given power dissipation

Τ

Τ

5.7 Switching Characteristics— RESET

Input leakage current (all digital pins with internal pull-up

resistors enabled, and XTI)

--

70

μA

Parameter

Min

Typ

Max

Unit

Power supply current:

PLL operating: VDDA

With external memory and most ports operating: VDDIO

1. Dependent on application firmware and DSP clock speed.

-

-

-

500

3.5

120

-

-

-

mA

mA

mA

Parameter

Symbol

Min

Typ

Max

Unit

Thermal Resistance (Junction to Ambient)

Two-layer Board1

Four-layer Board2

θ

ja

-

-

48

40

-

-

°C / Watt

Thermal Resistance (Junction to Top of Package)

Two-layer Board1

Four-layer Board2

ψ

jt

-

-

.39

.33

-

-

°C / Watt

Parameter

Symbol

Min

Typ

Max

Unit

Thermal Resistance (Junction to Ambient)

Two-layer Board1

Four-layer Board2

θ

ja

-

-

53

44

-

-

°C / Watt

Thermal Resistance (Junction to Top of Package)

Two-layer Board1

Four-layer Board2

ψ

jt

-

-

.45

.39

-

-

°C / Watt

Parameter

Symbol

Min

Max

Unit

RESET minimum pulse width low

1-

μs

All bidirectional pins high-Z after RESET low

-100

ns

Configuration pins setup before RESET high

50

-

ns

Parameter

Symbol

Min

Typ

Max

Unit