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PCF8566P 数据表(PDF) 39 Page - NXP Semiconductors |
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PCF8566P 数据表(HTML) 39 Page - NXP Semiconductors |
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39 / 48 page ![]() PCF8566_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 25 February 2009 39 of 48 NXP Semiconductors PCF8566 Universal LCD driver for low multiplex rates 15. Bare die outline Fig 31. Bare die outline PCF8566U REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA PCF8566U PCF8566U Notes 1. Pad size 2. Passivation opening UNIT mm max nom min 0.406 0.381 0.356 0.548 0.200 0.018 2.5 0.12 0.106 0.12 A DIMENSIONS (mm are the original dimensions) Wire bond die; 40 bonding pads; 2.5 x 2.91 x 0.381 mm e e 0 0.5 1 mm scale D E 2.91 e P1(1) P2(2) P3(1) P4(2) 0.106 36 37 38 39 40 25 24 23 22 21 20 19 18 17 16 1 C2 C1 F 23 4 5 10 9 8 7 6 33 34 35 11 12 13 14 15 28 27 26 29 31 30 32 A detail X P2 P1 P3 P4 D E X y 0 x 0 08-06-19 08-09-03 |
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