MCP4331-103ESLASHML datasheet(66/88 Pages) MICROCHIP

66 / 88 page

MCP433X/435X

DS22242A-page 66

 2010 Microchip Technology Inc.

Figure 8-8 shows possible layout implementations for

an application to support the quad and dual options on

the same PCB.

FIGURE 8-8:

Layout to support Quad and

Dual Devices.

8.4.2.3

PCB Area Requirements

In some applications, PCB area is a criteria for device

selection. Table 8-2 shows the package dimensions

and area for the different package options. The table

also shows the relative area factor compared to the

smallest area. For space critical applications, the QFN

package would be the suggested package.

8.4.3

RESISTOR TEMPCO

Characterization curves of the resistor temperature

coefficient (Tempco) are shown in Figure 2-11,

Figure 2-32, Figure 2-52, and Figure 2-72.

These curves show that the resistor network is

designed to correct for the change in resistance as

temperature increases. This technique reduces the

end to end change is RAB resistance.

8.4.4

HIGH VOLTAGE TOLERANT PINS

High voltage support (VIHH) on the Serial Interface pins

supports in-circuit accommodation of split rail

applications and power supply sync issues.

Potentiometers Devices

Rheostat Devices

MCP43X1

MCP42X1

MCP43X2

MCP42X2

TABLE 8-2:

PACKAGE FOOTPRINT (1)

Package

Package Footprint

Type

Code

Dimensions

(mm)

14 TSSOP

5.10

6.40 32.64 2.04

QFN

4.00

4.00 16.00

TSSOP

6.60

6.40 42.24 2.64

Note 1: Does not include recommended land

pattern dimensions.

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