TOP243Y datasheet(28/48 Pages) POWERINT

28 / 48 page

TOP242-249

7/01

August 8, 2000

Table 4 (cont). Comparison Between TOPSwitch-II and TOPSwitch-GX. *Not available

Function

TOPSwitch-FX

TOPSwitch-GX

TOPSwitch-GX Advantages

Light Load Operation

Cycle skipping

Frequency and Duty Cycle

• Improves light load efficiency

reduction

• Reduces no-load consumption

Line Sensing/Externally Line sensing and

Line sensing and externally

• Additional design flexibility allows all

Set Current Limit

externally set

set current limit possible

features to be used simultaneously

(Y and R Packages)

current limit

simultaneously

mutually

(functions split onto

exclusive (M pin)

L and X pins)

Current Limit

100-40%

100-30%

• Minimizes transformer core size

Programming

in highly continuous designs

Range

TOPSwitch-FX vs. TOPSwitch-GX

Table 5 compares the features and performance differences

between TOPSwitch-GX and TOPSwitch-FX. Many of the new

features eliminate the need for additional discrete components.

Other features increase the robustness of design allowing cost

savings in the transformer and other power components.

Function

TOPSwitch-II

TOPSwitch-GX Figures TOPSwitch-GX Advantages

Remote ON/OFF

N/A*

Single transistor

11, 22, • Fast on/off (cycle by cycle)

or optocoupler

23, 24, • Active-on or active-off control

interface or manual

25, 26, • Low consumption in remote off state

switch

27, 29, • Active-on control for fail-safe

36, 37, • Eliminates expensive in-line on/off

38, 39,

switch

• Allows processor controlled turn

on/off

• Permits shutdown/wake-up of

peripherals via LAN or parallel port

Synchronization

N/A*

Single transistor

• Synchronization to external lower

or optocoupler

frequency signal

interface

• Starts new switching cycle on

demand

Thermal Shutdown

125

°C min.

Hysteretic 130

°C

• Automatic recovery from thermal

Latched

min. Shutdown (with

fault

°C hysteresis)

• Large hysteresis prevents circuit

board overheating

Current Limit Tolerance

±10% (@25 °C)

±7% (@25 °C)

• 10% higher power capability due to

-8% (0

°C to100 °C) -4% (0 °C to 100 °C)

tighter tolerance

DRAIN

DIP

0.037" / 0.94 mm

0.137" / 3.48 mm

• Greater immunity to arcing as a

Creepage

SMD

0.037" / 0.94 mm

0.137" / 3.48 mm

result of build-up of dust, debris and

at Package

TO-220 0.046" / 1.17 mm

0.068" / 1.73 mm

other contaminants

DRAIN Creepage at

0.045" / 1.14 mm

0.113" / 2.87 mm

• Preformed leads accommodate

PCB for Y and R

(R Package N/A*)

(preformed leads)

large creepage for PCB layout

Packages

• Easier to meet Safety (UL/VDE)

Table 5. Comparison Between TOPSwitch-FX and TOPSwitch-GX. (continued on next page)

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