ADT7461

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2

Figure 1. Functional Block Diagram

SCLK

SDATA

GND

6

4

ADDRESS POINTER

REGISTER

LOCAL TEMPERATURE

LOW LIMIT REGISTER

LOCAL TEMPERATURE

HIGH LIMIT REGISTER

REMOTE TEMPERATURE

LOW LIMIT REGISTER

REMOTE TEMPERATURE

HIGH LIMIT REGISTER

LOCAL TEMPERATURE

VALUE REGISTER

REMOTE TEMPERATURE

VALUE REGISTER

ADC

ANALOG

MUX

ON−CHIP

TEMPERATURE

SENSOR

RUN/STANDBY

BUSY

REMOTE OFFSET

REGISTER

EXTERNAL DIODE OPEN−CIRCUIT

ADT7461

STATUS REGISTER

SMBus INTERFACE

LOCAL THERM LIMIT

REGISTER

EXTERNAL THERM LIMIT

REGISTER

CONFIGURATION

REGISTER

INTERRUPT

MASKING

7

5

1

8

THERM

ALERT/

THERM2

D+

D–

SRC

BLOCK

2

3

CONVERSION RATE

REGISTER

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

−0.3, +5.5

V

D+

V

D− to GND

−0.3 to +0.6

V

SCLK, SDATA, ALERT

−0.3 to +5.5

V

THERM

V

Input Current, SDATA, THERM

−1, +50

mA

Input Current, D−

±1

mA

ESD Rating, All Pins (Human Body Model)

2000

V

150

°C

Storage Temperature Range

−65 to +150

°C

IR Reflow Peak Temperature

220

°C

IR Reflow Peak Temperature for Pb−Free

260 (±0.5)

°C

Lead Temperature (Soldering 10 sec)

300

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

Package Type

Unit

8−Lead SOIC−N Package

121

°C/W

8−Lead MSOP Package

142

°C/W