SSTU32864ECSLASHG datasheet(2/21 Pages) PHILIPS

2 / 21 page

9397 750 14092

Product data sheet

Rev. 02 — 22 October 2004

2 of 21

Philips Semiconductors

SSTU32864

1.8 V conﬁgurable registered buffer for DDR2 RDIMM applications

Features

s Conﬁgurable register supporting DDR2 Registered DIMM applications

s Conﬁgurable to 25-bit 1:1 mode or 14-bit 1:2 mode

s Controlled output impedance drivers enable optimal signal integrity and speed

s Exceeds JESD82-7 speed performance (1.8 ns max. single-bit switching propagation

delay; 2.0 ns max. mass-switching)

s Supports up to 450 MHz clock frequency of operation

s Optimized pinout for high-density DDR2 module design

s Chip-selects minimize power consumption by gating data outputs from changing state

s Supports SSTL_18 data inputs

s Differential clock (CK and CK) inputs

s Supports LVCMOS switching levels on the control and RESET inputs

s Single 1.8 V supply operation

s Available in 96-ball, 13.5

× 5.5 mm, 0.8 mm ball pitch LFBGA package

Ordering information

Table 1:

Ordering information

Tamb =0 °Cto+70 °C.

Type number

Solder process

Package

Name

Description

Version

SSTU32864EC/G

Pb-free (SnAgCu

solder ball compound)

LFBGA96

plastic low proﬁle ﬁne-pitch ball grid array package;

96 balls; body 13.5

× 5.5 × 1.05 mm

SOT536-1

SSTU32864EC

SnPb solder ball

compound

LFBGA96

plastic low proﬁle ﬁne-pitch ball grid array package;

96 balls; body 13.5

× 5.5 × 1.05 mm

SOT536-1

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