PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

TXB0104D

ACTIVE

SOIC

D

14

50

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TXB0104DG4

ACTIVE

SOIC

D

14

50

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TXB0104DR

ACTIVE

SOIC

D

14

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TXB0104DRG4

ACTIVE

SOIC

D

14

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TXB0104GXUR

ACTIVE

BGA MI

CROSTA

R JUNI

OR

GXU

12

2500

TBD

SNPB

Level-1-240C-UNLIM

TXB0104PWR

ACTIVE

TSSOP

PW

14

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TXB0104PWRG4

ACTIVE

TSSOP

PW

14

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TXB0104RGYR

ACTIVE

VQFN

RGY

14

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TXB0104RGYRG4

ACTIVE

VQFN

RGY

14

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TXB0104RUTR

ACTIVE

UQFN

RUT

12

3000 Green (RoHS &

no Sb/Br)

Call TI

Level-1-260C-UNLIM

TXB0104YZTR

ACTIVE

DSBGA

YZT

12

3000 Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

TXB0104ZXUR

ACTIVE

BGA MI

CROSTA

R JUNI

OR

ZXU

12

2500 Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

PACKAGE OPTION ADDENDUM

www.ti.com

11-Mar-2010

Addendum-Page 1