SP3003 datasheet(4/8 Pages) LITTELFUSE

4 / 8 page

Revised: August 19, 2010

Speciﬁcations are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

SPA™ Silicon Protection Array Products

Low Capacitance ESD Protection Array

SP3003 Lead-Free/Green Series

Reﬂow Condition

Pb – Free assembly

Pre Heat

-Temperature Min (T

s(min))

150°C

-Temperature Max (T

s(max))

200°C

-Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp

L) to peak

3°C/second max

S(max) to TL - Ramp-up Rate

3°C/second max

Reﬂow

-Temperature (T

L) (Liquidus)

217°C

-Temperature (t

60 – 150 seconds

PeakTemperature (T

250+0/-5 °C

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peakTemperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

Application Example

Clk+

Gnd

Clk-

D2+

Gnd

D2-

D1+

Gnd

D1-

D0+

Gnd

D0-

HDMI

or DVI

Connector

HDMI

or DVI

Interface

D0+

D0-

D1+

D1-

D2+

D2-

Clk+

Clk-

SP300x-04

+5V

Gnd

SP300x-04

HDMI or DVI application example for the Littelfuse

SP300x-04 protection devices. A single 4 channel

SP300x-04 device can be used to protect four of the data

lines in a HDMI/DVI interface. Two (2) SP300x-04 devices

provide protection for the main data lines. Low voltage

ASIC HDMI/DVI drivers can also be protected with the

SP300x-04, the +V

CC pins on the SP300x-04 can be

substituted with a suitable bypass capacitor or in some

backdrive applications the +V

CC of the SP300x-04 can be

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