70

Revised: August 19, 2010

©2010 Littelfuse, Inc.

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

SPA™ Silicon Protection Array Products

Low Capacitance ESD Protection Array

SP3003 Lead-Free/Green Series

Product Characteristics

Lead Plating

Matte Tin (SC70-x, MSOP-10),

Pre-Plated Frame (SOT5x3)

Lead Material

Copper Alloy

Lead Coplanarity

0.0004 inches (0.102mm)

Subsitute Material

Silicon

Body Material

Molded Epoxy

Flammability

UL94-V-0

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. All specifications comply to JEDEC SPEC MO-223 Issue A

5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

6. Package surface matte finish VDI 11-13.

Part Numbering System

Part Marking System

SP3003-04 XTG

Silicon

Protection

Array

Series

Number of Channels

-02 = 2 channel

(SC70-5, SOT553 packages)

-04 = 4 channel

(SC70-6, SOT563, MSOP-10 packages)

Package

A = MSOP-10, 3000 quantity

J = SC70-5 or SC70-6, 3000 quantity

X = SOT553 or SOT563, 5000 quantity

T= Tape & Reel

G= Green

XXX

X X X

Product Series

(varies) F, H or P =

(varies)

Number of Channels

(varies) 2 or 4

Package Dimensions — SOT563

T

O

S

e

g

a

k

c

a

P

563

6

s

n

i

P

Millimeters

Inches

Min

Max

Min

Max

A

0.50

0.60

0.020

0.024

B

0.17

0.27

0.007

0.011

c

0.08

0.18

0.003

0.007

D

1.50

1.70

0.059

0.067

E

1.10

1.30

0.043

0.051

e

0.50 BSC

0.020 BSC

L

0.10

0.30

0.004

0.012

HE

1.50

1.70

0.059

0.067

c

HE

L

A

D

6

4

2

3

E

e

B

5

Solder Pad Layout

Package Dimensions — MSOP10

0

1

P

O

S

M

e

g

a

k

c

a

P

0

1

s

n

i

P

Millimeters

Inches

Min

Max

Min

Max

A

-

1.10

-

0.043

A1

0.00

0.15

0.000

0.006

B

0.17

0.27

0.007

0.011

c

0.08

0.23

0.003

0.009

D

2.90

3.10

0.114

0.122

E

4.67

5.10

0.184

0.200

E1

2.90

3.10

0.114

0.122

e

0.50 BSC

0.020 BSC

HE

0.40

0.80

0.016

0.031

Solder Pad Layout