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AD9550/PCBZ 数据表(PDF) 17 Page - Analog Devices

部件名 AD9550/PCBZ
功能描述  Integer-N Clock Translator for Wireline Communications
PDF  20 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

AD9550/PCBZ 数据表(HTML) 17 Page - Analog Devices

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AD9550
Rev. 0 | Page 17 of 20
APPLICATIONS INFORMATION
THERMAL PERFORMANCE
The AD9550 is specified for case temperature (TCASE). To ensure
that TCASE is not exceeded, use an airflow source.
The following equation determines the junction temperature on
the application printed circuit board (PCB):
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the customer
at the top center of the package.
ΨJT is the value indicated in Table 11.
PD is the power dissipation (see Table 1 for the power
consumption parameters).
Values of θJA are provided for package comparison and PCB design
considerations. θJA can be used for a first-order approximation
of TJ using the following equation:
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of θJB are provided for package comparison and PCB
design considerations.
Table 11. Thermal Parameters for the 32-Lead LFCSP
Symbol
Description
Value1
Unit
θ
JA
Junction-to-ambient thermal
resistance, 0 m/sec airflow per
JEDEC JESD51-2 (still air)
41.6
°C/W
θ
JMA
Junction-to-ambient thermal
resistance, 1.0 m/sec airflow per
JEDEC JESD51-6 (moving air)
36.4
°C/W
θ
JMA
Junction-to-ambient thermal
resistance, 2.5 m/sec airflow per
JEDEC JESD51-6 (moving air)
32.6
°C/W
θ
JB
Junction-to-board thermal
resistance, 0 m/sec airflow per
JEDEC JESD51-8 (still air)
24.2
°C/W
Ψ
JB
Junction-to-board characterization
parameter, 0 m/sec airflow per
JEDEC JESD51-6 (still air)
22.9
°C/W
θ
JC
Junction-to-case thermal resistance
4.8
°C/W
Ψ
JT
Junction-to-top-of-package
characterization parameter, 0 m/sec
airflow per JEDEC JESD51-2 (still air)
0.5
°C/W
1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal
performance for actual applications requires careful inspection of the
conditions in the application to determine whether they are similar to those
assumed in these calculations.



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