M24C32-W M24C32-R M24C32-F

Package mechanical data

Doc ID 4578 Rev 17

31/38

Figure 16.

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package outline

1.

Drawing is not to scale.

2.

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 20.

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package mechanical data

Symbol

millimeters

1.

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

A

0.55

0.50

0.60

0.0217

0.0197

0.0236

A1

0.02

0.00

0.05

0.0008

0

0.0020

b

0.25

0.20

0.30

0.0098

0.0079

0.0118

D

2.00

1.90

2.10

0.0787

0.0748

0.0827

D2

1.60

1.50

1.70

0.0630

0.0591

0.0669

ddd

0.08

0.0031

E

3.00

2.90

3.10

0.1181

0.1142

0.1220

E2

0.20

0.10

0.30

0.0079

0.0039

0.0118

e0.50–

–

0.0197

–

–

L

0.45

0.40

0.50

0.0177

0.0157

0.0197

L1

0.15

0.0059

L3

0.30

0.0118

D

E

UFDFPN-01

A

A1

ddd

L1

e

b

D2

L

E2

L3