LTM8031

14

8031fa

APPLICATIONS INFORMATION

Figure 4. A Well Chosen Input Network Prevents Input Voltage Overshoot and Ensures

Reliable Operation When the LTM8031 is Hot-Plugged to a Live Supply

correlation. Bear in mind that the actual thermal resistance

of the LTM8031 to the printed circuit board depends upon

the design of the circuit board. The die temperature of

the LTM8031 must be lower than the maximum rating of

125°C, so care should be taken in the layout of the circuit

to ensure good heat sinking of the LTM8031.

The bulk of the heat flow out of the LTM8031 is through the

bottom of the module and the LGA pads into the printed

circuit board. Consequently a poor printed circuit board

design can cause excessive heating, resulting in impaired

performance or reliability. Please refer to the PCB Layout

section for printed circuit board design suggestions.

Finally, be aware that at high ambient temperatures the

internal Schottky diode will have significant leakage current

increasing the quiescent current of the LTM8031.

+

LTM8031

4.7μF

20V/DIV

10A/DIV

20μs/DIV

CLOSING SWITCH

SIMULATES HOT PLUG

(4a)

(4b)

LOW

IMPEDANCE

ENERGIZED

24V SUPPLY

STRAY

INDUCTANCE

DUE TO 6 FEET

(2 METERS) OF

TWISTED PAIR

+

LTM8031

4.7μF

0.1μF

0.7Ω

20V/DIV

10A/DIV

20μs/DIV

DANGER

ABSOLUTE MAXIMUM RATING

(4c)

+

4.7μF

22μF

35V

AI.EI.

8031 F04

20V/DIV

10A/DIV

20μs/DIV

+

LTM8031

FIN