STW4811MBRATSLASHHF datasheet(79/85 Pages) STMICROELECTRONICS

部件名	STW4811MBRAT/HF

功能描述	Power management for multimedia processors

PDF	85 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

79 / 85 page

STw4811M/STw4811N

Package mechanical data

CD00131784

79/85

Package mechanical data

In order to meet environmental requirements, ST-Ericsson offers these devices in

ECOPACK® packages. These packages have a Lead-free second level interconnect. The

category of second Level Interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is a trademark of

STMicroelectronics group of companies. ECOPACK specifications are available at:

www.st.com.

7.1

TFBGA 84 balls

See

Figure 17: TFBGA 84 balls 6x6x1.2mm body size / 0.5 ball pitch drawing.

Table 56.

TFBGA 84 balls 6x6x1.2mm body size / 0.5 ball pitch dimensions(1)

These measurements conform to JEDEC standards

Drawing dimensions (mm)

Min.

Typ.

Max.

1.16

0.20

0.25

0.30

0.82

0.250.300.35

5.906.006.10

4.50

5.906.006.10

4.50

0.450.500.55

0.650.750.85

ddd

0.08

STW4811MBRAT/HF 数据表(PDF) 79 Page - STMicroelectronics

STW4811MBRAT/HF 数据表(HTML) 79 Page - STMicroelectronics

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