STM32F103C8T7TR datasheet(77/96 Pages) STMICROELECTRONICS

部件名	STM32F103C8T7TR

功能描述	Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 communication interfaces

PDF	96 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

77 / 96 page

STM32F103x8, STM32F103xB

Package characteristics

Doc ID 13587 Rev 12

77/96

Drawing is not to scale.

The back-side pad is not internally connected to the VSS or VDD power pads.

There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should

also be soldered to the PCB. It is recommended to connect it to VSS.

Figure 40.

VFQFPN36 6 x 6 mm, 0.5 mm pitch,

package outline(1)

Figure 41.

Recommended footprint

(dimensions in mm)(1)(2)(3)

Seating plane

ddd

Pin # 1 ID

R = 0.20

ZR_ME

0.30

6.30

0.50

1.00

4.30

4.80

4.10

ai14870b

0.75

Table 50.

VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.800

0.900

1.000

0.0315

0.0354

0.0394

0.020

0.050

0.0008

0.0020

0.650

1.000

0.0256

0.0394

0.250

0.0098

0.180

0.230

0.300

0.0071

0.0091

0.0118

5.875

6.000

6.125

0.2313

0.2362

0.2411

1.750

3.700

4.250

0.0689

0.1457

0.1673

5.875

6.000

6.125

0.2313

0.2362

0.2411

1.750

3.700

4.250

0.0689

0.1457

0.1673

0.450

0.500

0.550

0.0177

0.0197

0.0217

0.350

0.550

0.750

0.0138

0.0217

0.0295

ddd

0.080

0.0031

Values in inches are converted from mm and rounded to 4 decimal digits.

STM32F103C8T7TR 数据表(PDF) 77 Page - STMicroelectronics

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