SPD09P06PLG datasheet(2/9 Pages) INFINEON

2 / 9 page

200

8-07-29

Rev 2.5

Page 2

SPD09P06PL

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - case

RthJC

3.6

K/W

Thermal resistance, junction - ambient, leaded

RthJA

100

SMD version, device on PCB:

@ min. footprint

@ 6 cm2 cooling area 1)

RthJA

Electrical Characteristics, at Tj = 25 °C, unless otherwise specified

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Drain-source breakdown voltage

VGS=0V, ID=-250µA

V(BR)DSS

-60

Gate threshold voltage, VGS = VDS

ID=-250µA

VGS(th)

-1

-1.5

-2

Zero gate voltage drain current

VDS=-60V, VGS=0V, Tj=25°C

VDS=-60V, VGS=0V, Tj=150°C

IDSS

-0.1

-10

-1

-100

µA

Gate-source leakage current

VGS=-20V, VDS=0V

IGSS

-10

-100

Drain-source on-state resistance

VGS=-4.5V, ID=-5.4A

RDS(on)

0.3

0.4

Drain-source on-state resistance

VGS=-10V, ID=-6.8A

RDS(on)

0.2

0.25

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.

SPD09P06PLG 数据表(PDF) 2 Page - Infineon Technologies AG

SPD09P06PLG 数据表(HTML) 2 Page - Infineon Technologies AG

Html Pages

1 2 3 4 5 6 7 8 9

数据表下载