Data Sheet

4

V2.0, 2009-04-01

BGF124

SIM Card Interface Filter and USB Interface with ESD Protection

BGF124

BGF124

Description

BGF124 is an ESD protection and filtering circuit for SIM card and USB interfaces. All external IOs are protected

against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green

lead-free and halogen-free package with a size of only 1.15 mm x 1.55 mm and a total height of 0.6 mm

Figure 1

Schematic

Features

•

ESD protection circuit and interface filter for SIM cards

•

Reduced line capacitance of 12 pF maximum

•

ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on

external IOs

•

Wafer level package with SnAgCu solder balls

•400

µm solder ball pitch

•

RoHS and WEEE compliant package

Type

Package

Marking

Chip

BGF124

WLP-11-4

24

N0744

Table 1

Maximum Ratings

Parameter

Symbol

Values

Unit

Note /

Test Condition

Min.

Typ.

Max.

Voltage at all pins to GND

V

P

0–

5V

–

Operating temperature range

T

OP

-40

–

+85

°C–

Storage temperature range

T

STG

-65

–

+150

°C–

Summed up input power for all pins

P

in

––

60

mW

T

Electrostatic Discharge According to IEC61000-4-2

Contact discharge at internal pins A1, B1, C1

V

ESD

-2

–

2

kV

–

Contact discharge at external pins A3, B3, C3,

D1, D2, D3

V

ESD

-15

–

15

kV

–

WLP-11-4-N

BGF124 _schematic.vsd

GND, A2, C2

C3

B3

A3

C1

B1

A1

R1, 100

Ω

R2, 47

Ω

R3, 100

Ω

D1

Ext. IOs

D2

D3