Data Sheet

6

V2.0, 2009-04-01

BGF124

SIM Card Interface Filter and USB Interface with ESD Protection

BGF124

Figure 3

Typical Cross Talk

Package Outlines

Figure 4

WLP-11-4 (Wafer Level Package)

BGF124 cross talk

-100

-80

-60

-40

-20

0

1

10

100

1000

10000

MHz

C1-B3

D1-C1

D1-D2

Corner Index Area

Pin 1

2)

COPLANARITY

0.6

0.08

11x

C

C

STANDOFF

±0.05

0.2

±0.05

)

(0.175

±0.05

0.1 C

0.4

±0.05

1.15

B

A

A

11x

0.25

B

±0.04

1)

3) Primary datum C and seating plane are defined by the domed crowns of the balls

1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C

2) Identified by marking

WLP-11-4-N-PO V01

2 x 0.4 = 0.8

D3

D2

D1

C2

A2

C3

B3

C1

B1

A3

A1

Solder balls face down

Solder balls face up